In the development of modern power electronics industry, high-density, high flexibility, and high reliability packaging has become the key.
At Dike DKEM ?， Focusing on core technological capabilities, we focus on the material science challenges in the field of semiconductor and power electronic interconnection packaging, and are committed to empowering a colorful interconnected world through diverse electronic adhesive products.
Conductive adhesive, as a key chip interconnection packaging material, promotes the development of electronic products in micro, lightweight, multifunctional, highly integrated, and highly reliable aspects.
As the key to the development of the third-generation power semiconductor industry, the high thermal conductivity and high reliability of AMB ceramic copper clad plates cannot be separated from the bridge role of active metal brazing slurry.
